WELCOME TO TEMPCO!

We are pleased to announce that Brian Saboriendo has joined the Tempco team in the position of Design Engineer as of June 14, 2021. 

Brian comes to us from the Argonne National Laboratory where he performed CAD modeling and 3D printing for various non-destructive evaluation applications among other duties. He was also an Undergraduate Researcher at DePaul University while pursuing his education.

Brian has an excellent academic record and holds joint degrees from DePaul University with a Bachelor of Science in Physics, and a Bachelor of Science in Mechanical Engineering from the Illinois Institute of Technology. We believe his qualifications and talent will result in a significant strengthening of Tempco’s design engineering function.

Please join in extending a warm welcome to Brian from the entire Tempco family as he transitions into his new position!